Post #3993681

This is what I'm thinking. Dividing up assembly into 3 circular rigid flex regions (magnetics/POE power/phy; processing; and image sensor). These would fold up together, and this would be the outside one with all the tall components on the backside. The PHY and the 60v to 3.3v SMPS module would be noisy in proximity to the Ethernet magnetics. The SMPS does have spread spectrum. Cat5 would solder directly to the board. The rectangle represents the transition to flex and it's bend radius.