Post #3562103
2026-07-03 17:37 UTC
There are three pads on this die which were not bonded out. These likely relate to the two other versions, R65C102 and R65C112, though I can't confirm that as I can't locate these parts anywhere on the market. I'd bet the only difference was in the metal routing.
Replies (1)
-
@infosecdj@infosec.exchange 2026-07-03 17:43
The overall die layout is very much the same as for the NMOS 6502: the instruction register at the top, the microcode PLA on the left, the 8-bit datapath on the right, and datapath control inbetween them. But zooming in, there are differences. For example, the order of signals in the microcode is slightly different. This is to be expected, as the instruction set was amended to include 59 new opcodes for 12 new instructions, among other things.