Post #2260829
2026-05-08 13:29 UTC
Removing the RDL gives us a better view of the die. There seems to be 1 aluminium plating layer plus at least 3 metal layers going down. It's hard to say for sure at this time.
2/n
Replies (1)
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@infosecdj@infosec.exchange 2026-05-08 13:31
And with RLD removed, the die ID is in full view. CSEM may be very well referring to these people: https://www.csem.ch/en/industry/semiconductors/ Interestingly, this is version 3 revision C, if I understand this correctly. I wonder what were all the previous major revisions used for? 3/n