Post #1581479
2026-03-08 10:31 UTC
For comparison, here is another pad type. Here, there is no small-power logic present, at all. Fewer transistors in the medium-drive section. Power FETs were turned into ESD protection diodes: no gate connection. And only a single wire running down to the rest of the chip.
Replies (1)
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@infosecdj@infosec.exchange 2026-03-08 11:13
Here is the answer re what's under all that power distribution routing around the chip. Capacitors. Vias through the opening go from poly to upper metal, vias on the perimeter go to M1.