Post #1581455
2026-03-20 13:40 UTC
Interestingly, the thick infill area was way more resistant to the lapping process and the majority of metal-3 remained there, while the rest got stripped off.
There is a lot of analog circuitry on the bottom and right sides of the chip. I am not sure why there is so much and what it does exactly.
Replies (1)
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@infosecdj@infosec.exchange 2026-03-20 13:46
A detail view on the analog section; the features on the right seem to be four resistor arrays of the same value, and those on the left are multiple capacitors connected in parallel. I wonder why they decided to make multiple separate parts instead of making a large one of required geometry.