@malwareminigun@infosec.exchange
Post #1308613
2026-02-03 16:17 UTC
@CursedFootprint @whitequark @azonenberg do you think that would have gotten better utilization of a wafer?
Replies (1)
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@azonenberg@ioc.exchange 2026-02-03 16:19
@malwareminigun @CursedFootprint @whitequark The die would have been square still (a hexagonal die is a whole other can of worms and would likely be extremely difficult to make on a standard CMOS process with wafers which naturally cleave at 90 degree angles, although it would be doable on the... older BJT processes, I think, using ). The goal was to allow the packages to hex-tile with adjacent processors on a supercomputer logic board and have very short routing hops for interconnect to six, rather than four, neighbors