Post #1308614

@malwareminigun @CursedFootprint @whitequark The die would have been square still (a hexagonal die is a whole other can of worms and would likely be extremely difficult to make on a standard CMOS process with wafers which naturally cleave at 90 degree angles, although it would be doable on the... older BJT processes, I think, using ). The goal was to allow the packages to hex-tile with adjacent processors on a supercomputer logic board and have very short routing hops for interconnect to six, rather than four, neighbors