Post #809451
2026-03-03 18:27 UTC
Does anyone know how Apple's chiplet fusion dies are configured?
I'm tempted to guess that they are:
- the CPU cores die;
- the GPU and Additional memory controllers die.
So we have:
- 2 bins of the same main die design across the M-Pro and M-Max;
- 3 or 4 separate GPU / Memory Controller die designs across lineup.
... which is really the proper way of doing how Apple chopped the M1-Pro vs M1-Max?
Maybe possible die designs like this?
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