Post #2778029

@geerlingguy On Sipeed NanoCluster for CM5 I wonder if a Cu or AL heatsink could be made to make contact with both ends of a module and the neighbor adapter such as all modules fit snugly in between the _fins_. Some thermal pads. I wonder if this would be a practical solution since that would require a high precision of the width of the metal fins and the two pads covering each fin and module / SOM adapter. Maybe with a giant fan on top would allow good cooling!?