Post #2215893

decapsulated and imaged the CPU-TWL, the main chip in the Nintendo DSi image in near-IR, through-substrate, with a 50x objective the decapsulation process was a bit haphazard as I don't have access to acids. instead, I heated up the chip to ~500 °C with a hot air station, which let me cut the chip carrier/interposer off from the epoxy mold using an xacto knife. I then had to remove another polymer coating (using the xacto knife, hwile heating it up to 250 °C), which unfortunately led to some scratch marks. the die is also weirdly curved, which led to some issues with keeping the entire thing in focus. but hey, it's something